BAR 64-02EL E6327

BAR64-02EL Low signal distortion, surface mount RF PIN diode Product description This Infineon cost optimized RF PIN diode is designed for low distortion switches that require to hold off large RF voltages, and is best suited for frequencies as high as 6 GHz. Its nominal 50 μm I-region width, combined with the typical 1.55 μs carrier lifetime, result in a diode with low forward resistance and low distortion characteristics. Feature list • • • • • • Low signal distortion, charge carrier lifetime trr = 1.55 µs (typical) Ultra low capacitance C = 0.14 pF (typical) at voltage VR = 0 and frequencies f ≥ 1 GHz Low forward resistance RF = 2 Ω (typical) at forward current IF = 10 mA and frequency f = 100 MHz Low inductance Ls = 0.4 nH (typical) TSLP-2-19 package (1 mm x 0.6 mm x 0.31 mm) with a 0402 foot print Pb-free, RoHS compliant and halogen-free Product validation Qualified for industrial applications according to the relevant tests of JEDEC47/20/22. Potential applications Optimized for low bias current RF and high-speed interface switches and attenuators • Wireless communication • High speed data networks Device information Table 1 Part information Product name / Ordering code Package Pin configuration Marking Pieces / Reel BAR64-02EL / BAR6402ELE6327XTMA1 TSLP-2-19 Single, leadless OE 15 k Attention: ESD (Electrostatic discharge) sensitive device, observe handling precautions! Datasheet www.infineon.com Please read the Important Notice and Warnings at the end of this document v1.0 2018-06-30 BAR64-02EL Low signal distortion, surface mount RF PIN diode Table of contents Table of contents Product description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Feature list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Product validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Potential applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Device information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 2 2.1 2.2 Electrical performance in test fixture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 3 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 Package information TSLP-2-19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 1 Absolute maximum ratings Table 2 Absolute maximum ratings at TA = 25 °C, unless otherwise specified Parameter Symbol Values Min. Unit Note or test condition Max. Diode reverse voltage VR – 150 V Forward current IF – 100 mA Total power dissipation PTOT – 250 mW Junction temperature TJ – 150 °C Operating temperature TOP -55 125 Storage temperature TSTG -55 150 TS ≤ 135 °C 1) Attention: Stresses above the maximum values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Exceeding only one of these values may cause irreversible damage to the component. 1 TS is the soldering point temperature. Datasheet 2 v1.0 2018-06-30 BAR64-02EL Low signal distortion, surface mount RF PIN diode Electrical performance in test fixture 2 Electrical performance in test fixture 2.1 DC characteristics At TA = 25 °C, unless otherwise specified Table 3 DC characteristics Parameter Symbol Values Min. Typ. Max. Unit Note or test condition Breakdown voltage VBR 150 – – V IR = 5 µA Reverse current IR – – 20 nA VR = 20 V Forward voltage VF – 0.82 – V IF = 10 mA – 0.9 – IF = 50 mA – 0.95 1.1 IF = 100 mA – 50 – I-region width WI μm 10 2 I F [mA] 10 1 10 0 10 -1 10 -2 10 -3 0.2 0.4 0.6 0.8 1 1.2 V F [V] Figure 1 Datasheet Forward current IF vs. forward voltage VF 3 v1.0 2018-06-30 BAR64-02EL Low signal distortion, surface mount RF PIN diode Electrical performance in test fixture 2.2 AC characteristics At TA = 25 °C, unless otherwise specified Table 4 Key parameter Parameter Symbol Capacitance C Forward resistance RF Values Unit Note or test condition pF VR = 0 V, f = 1 MHz Min. Typ. Max. – 0.53 – – 0.17 0.35 – 9.6 20 – 4 – IF = 3 mA, f = 100 MHz – 2.9 – IF = 5 mA, f = 100 MHz – 2 2.8 IF = 10 mA, f = 100 MHz – – 1.35 IF = 100 mA, f = 100 MHz VR = 20 V, f = 1 MHz Ω IF = 1 mA, f = 100 MHz Inductance Ls – 0.4 – nH Charge carrier lifetime τrr – 1550 – ns IF = 10 mA, IR = 6 mA, measured at IR = 3 mA, RL = 100 Ω Unit Note or test condition Table 5 AC parameter at f = 1 GHz Parameter Symbol Values Min. Typ. Max. Capacitance C – 0.14 – pF VR = 0 V Reverse parallel resistance RP – 3.7 – kΩ VR = 0 V Forward resistance RF – 9.4 – Ω IF = 1 mA – 4.1 – IF = 3 mA – 3 – IF = 5 mA – 2.2 – IF = 10 mA – 0.76 – – 0.33 – IF = 3 mA – 0.25 – IF = 5 mA – 0.18 – IF = 10 mA – 20.2 – VR = 0 V Insertion loss IL Isolation Table 6 ISO dB IF = 1 mA AC parameter at f = 1.8 GHz Parameter Symbol Values Min. Typ. Max. Unit Note or test condition Capacitance C – 0.13 – pF VR = 0 V Reverse parallel resistance RP – 3.1 – kΩ VR = 0 V Datasheet 4 v1.0 2018-06-30 BAR64-02EL Low signal distortion, surface mount RF PIN diode Electrical performance in test fixture Table 6 AC parameter at f = 1.8 GHz (continued) Parameter Symbol Forward resistance RF Insertion loss IL Isolation Table 7 ISO Values Unit Note or test condition Ω IF = 1 mA Min. Typ. Max. – 9.3 – – 4.2 – IF = 3 mA – 3.1 – IF = 5 mA – 2.3 – IF = 10 mA – 0.76 – – 0.35 – IF = 3 mA – 0.26 – IF = 5 mA – 0.19 – IF = 10 mA – 15.7 – VR = 0 V dB IF = 1 mA AC parameter at f = 2.5 GHz Parameter Symbol Values Min. Typ. Max. Unit Note or test condition Capacitance C – 0.13 – pF VR = 0 V Reverse parallel resistance RP – 2.9 – kΩ VR = 0 V Forward resistance RF – 9.3 – Ω IF = 1 mA – 4.3 – IF = 3 mA – 3.3 – IF = 5 mA – 2.5 – IF = 10 mA – 0.77 – – 0.36 – IF = 3 mA – 0.27 – IF = 5 mA – 0.2 – IF = 10 mA – 13.6 – VR = 0 V Insertion loss Isolation Table 8 Parameter Insertion loss Isolation Datasheet IL ISO dB IF = 1 mA AC parameter at f = 5.5 GHz Symbol IL ISO Values Unit Note or test condition dB IF = 1 mA Min. Typ. Max. – 0.83 – – 0.48 – IF = 3 mA – 0.34 – IF = 5 mA – 0.27 – IF = 10 mA – 7.8 – VR = 0 V 5 v1.0 2018-06-30 BAR64-02EL Low signal distortion, surface mount RF PIN diode Electrical performance in test fixture 0.6 0.5 C [pF] 0.4 1 MHz 1 GHz 1.8...3 GHz 0.3 0.2 0.1 0 5 10 15 20 25 30 35 40 VR [V] Figure 2 Capacitance C vs. reverse voltage VR at different frequencies Figure 3 Reverse parallel resistance RP vs. reverse voltage VR at different frequencies Datasheet 6 v1.0 2018-06-30 BAR64-02EL Low signal distortion, surface mount RF PIN diode Electrical performance in test fixture Figure 4 Forward resistance RF vs. forward current IF at different frequencies 0 -0.2 -0.4 I L [dB] 100 mA 10 mA 5 mA 3 mA 1 mA -0.6 -0.8 -1 0 1 2 3 4 5 6 f [GHz] Figure 5 Datasheet Insertion loss IL vs. frequency f at different forward currents 7 v1.0 2018-06-30 BAR64-02EL Low signal distortion, surface mount RF PIN diode Electrical performance in test fixture 0 -5 I SO [dB] -10 -15 -20 0V 1V 10 V -25 -30 -35 0 1 2 3 4 5 6 f [GHz] Figure 6 Note: Datasheet Isolation ISO vs. frequency f at different reverse voltages The curves shown in this chapter have been generated using typical devices but shall not be understood as a guarantee that all devices have identical characteristic curves. 8 v1.0 2018-06-30 BAR64-02EL Low signal distortion, surface mount RF PIN diode Thermal characteristics 3 Thermal characteristics Table 9 Thermal resistance Parameter Sym bol Thermal resistance (junction - soldering point) RthJS Values Min. Typ. Max. – 60 – Unit Note or test condition K/W TS = 135 °C 2) 120 100 I F [mA] 80 60 40 20 0 0 20 40 60 80 100 120 140 160 T S [°C] Figure 7 2 Permissible forward current IF in DC operation For RthJS in other conditions refer to the curves in this chapter. Datasheet 9 v1.0 2018-06-30 BAR64-02EL Low signal distortion, surface mount RF PIN diode Thermal characteristics Figure 8 Thermal resistance RthJS in pulse operation Figure 9 Permissible forward current ratio IFmax/IDC in pulse operation Datasheet 10 v1.0 2018-06-30 BAR64-02EL Low signal distortion, surface mount RF PIN diode Package information TSLP-2-19 4 Package information TSLP-2-19 Figure 10 Package outline Figure 11 Foot print Figure 12 Marking layout example Figure 13 Tape dimensions Note: Datasheet See our Recommendations for Printed Circuit Board Assembly of TSLP/TSSLP/TSNP Packages . The marking layout is an example. For the real marking code refer to the device information on the first page. The number of characters shown in the layout example is not necessarily the real one. The marking layout can consist of less characters. 11 v1.0 2018-06-30 BAR64-02EL Low signal distortion, surface mount RF PIN diode References 5 [1] References Infineon AG - Recommendations for Printed Circuit Board Assembly of Infineon TSLP/TSSLP/TSNP Packages Revision history Document version Date of release Description of changes 1.0 2018-09-07 • • • • • 1.1 Datasheet 2019-01-21 Change from series datasheet to individual one Initial release of datasheet Typical values and curves updated to the values of the production (No product or process change behind) Maximum/typical values added Typical curves/values removed Product description, feature list and potential application section reworked 12 v1.0 2018-06-30 Trademarks All referenced product or service names and trademarks are the property of their respective owners. Edition 2018-06-30 Published by Infineon Technologies AG 81726 Munich, Germany © 2019 Infineon Technologies AG All Rights Reserved. Do you have a question about any aspect of this document? Email: erratum@infineon.com Document reference IFX-pnm1535375426055 IMPORTANT NOTICE The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. WARNINGS Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 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